Encapsulation and Molding

  • Impulse-PDM
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Key Features:

With a highly experienced team of molding specialists, Teledyne Impulse-PDM is able to offer a full range of encapsulation and molding services


Teledyne Impulse-PDM moldings are produced in synthetic resins and elastomers for many applications including high voltage terminations, precision components and other demanding product specifications.​​

Benefits:

​Impulse-PDM's extensive experience and molding and test facilities result in higher reliability solutions, assuring operational excellence over the life of the system​​

​The underlying science of adhesion and immersion has been extensively studied, simulated, and tested at Teledyne Impulse-PDM's laboratory in Alton, UK. With more than 25 years' experience in subsea engineering, Impulse-PDM offers high quality design and development services for all connectivity requirements.​

The bonding of a polymer to a metal substrate is influenced by a number of interactive mechanical, physical and chemical forces. Connector stability in an aggressive marine environment requires:

  • Appropriate and careful metal/material selection.
  • Preparation of metal/material surfaces to ensure maximum adhesion of subsequent coatings.
  • Appropriate selection of primer system.
  • Correct application of the selected primer system to the prepared surface
  • Overmolding with an appropriate selection of castable polyurethane
  • A post-production testing regime.

All stages of the production process requires a detailed knowledge of the science involved and the optimum use of these principles at the various stages of the fabrication

Applications

  • Specialist techniques to encapsulate printed circuit boards, and fragile components such as fiber optics and fine wiring assemblies for mechanical protection and to prevent moisture ingress
  • Encapsulation and molding using polyurethanes, polyethylenes and epoxies
  • Encapsulation under vacuum or pressure, open cast or molded, in custom designed tooling
  • Potting and molding using transparent or colored materials
  • Encapsulation using materials formulated to suit specific requirements
  • Ruggedizing and waterproofing cables
  • Design and manufacture of complex, intricate molds ranging from 10mm to 2m in length
  • Machining encapsulated assemblies to facilitate further mechanical assembly operations
  • Encapsulation of PCB assemblies and sensitive devices​